Semiconductor manufacturing

The semiconductor manufacturing process at Nedinsco involves a very intricate process in a carefully controlled environment. We create the integrated circuits that are present in electronic devices and appliances that other businesses rely on to create their products.

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Our process begins with a grain of sand and completes with a finished product that drives your business.

Silicon is traditionally used in making wafers which are then cut into small chips to use for several applications.Silicon has the ability to conduct or block electricity flow depending on how it is treated. Because transistors are incredibly small, the silicon that it sits on needs to undergo a flawless process involving many different steps in order to function reliably.

After the process is complete, what was once just a pile of shifting sand with little monetary value can now be used for different applications that are immensely useful, durable, cost effective, and deliver a healthy return on your investment.

The Semiconductor Manufacturing Process

It begins with melting polysilicon inside a specially sealed furnace that’s purged with argon gas so as to eliminate any air inside. It’s heated over 2,500 degrees; once melted, it’s spun with a silicon seed crystal which is slowly taken out at around one and a half millimeters every minute.

This produces a single silicon crystal which is then tested for purity and molecular orientation before it’s sliced into ⅔ of a millimeter thick wafers. It then goes through a process called lapping to buff out microscoping marks left on the wafer. By then, the wafer is still not smooth enough so it goes through a second buffing process using a chemical which results in a surface roughness that’s less than one millionth of a millimeter.

Next step semiconductor manufacturing

The next step in semiconductor manufacturing is circuit design. This is where it gets more complicated as the transistor has to be protected from even the smallest dust particle that can cause its havoc. Its size is only ten-thousandth of a millimeter which means that staff has to work on a microscopic scale making sure no dust particle settles on the wafer.

To achieve this, the wafer goes through front opening unified pods (FUCHS) before it is imprinted with complex designs through a process called photolithography which makes metal lithographic printing plates by acid etching.

The wafer is first coated with photosensitive chemicals which are then hardened by exposing it to UV light. Inside sealed dark rooms, light is exposed through the design onto the coated wafer. Once the chemical is washed off, the design hardens on the wafer-like a developed photographic image.

It cycles through about 40 times through the FUCHS adding the components in each layer that make the chip’s unique design. Some layers involve diffusion which bake impurities into areas of the wafer altering its electrical characteristics or deposition which grows an insulating layer onto the silicon substrate. There can also be sequences involving ion implantation where silicon is infused into various dopants to modify its electrical characteristics.

Before slicing the final sheets, each chip on the wafer is checked for functionality. Chips that don’t pass the test are marked with an ink and later discarded after slicing while the remaining chips undergo a second inspection before it is sent for assembly.

The Semiconductor manufacturing process

The semiconductor manufacturing process described above is generally used across the industry. Proficiency in performing such steps is important to succeed in such a highly competitive market.

Execute semiconductor manufacturing steps

One of Nedinsco’s mission is to execute semiconductor manufacturing steps flawlessly to ensure each chip uniformly complies with the specifications that perform a number of essential functions.

To maintain the purity of our products, we perform these processes in a class 1 clean room supported by 12,000 tons of air conditioning to ensure that the air is clean. This allows us to work at a microscopic scale without worry of contamination.

Nedinsco Venlo has been recognized by its global B2B customers and stakeholders as a high quality, innovative, and trusted semiconductor fabrication company producing systems that integrate with technologies such as high-end cameras, satellites, analytical equipment, surveying materials, and photonic sensors. We focus on providing semiconductor systems for industrial, defense, and aerospace applications.